Metallic Material for Electronic Components and Method for Producing Same, and Connector Terminals, Connectors and Electronic Components Using Same

ABSTRACT

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.40 μm; and the thickness of the upper layer is 0.02 μm or more and less than 1.00 μm.

TECHNICAL FIELD

The present invention relates to a metallic material for electronic components and a method for producing the same, and connector terminals, connectors and electronic components using the same.

BACKGROUND ART

In connectors as connecting components for electronic devices for consumer use and for vehicle use, materials are used in which base plating of Ni or Cu is applied to the surface of brass or phosphor bronze materials and Sn or Sn alloy plating is further applied to the base plating. Sn or Sn alloy plating is generally required to have properties such as low contact resistance and high solder wettability, and further, recently the reduction of the insertion force has also been required at the time of joining together a male terminal and a female terminal molded by press processing of plating materials. In the production process, on the plating surface, there occur sometimes whiskers, which are needle crystals, causing problems such as short circuiting, and hence such whiskers are also required to be suppressed satisfactorily.

In this regard, Patent Literature 1 discloses an electrical contact material including a contact base material, a ground layer composed of Ni or Co, or an alloy of both of Co and Ni and formed on the surface of the contact base material, and an Ag—Sn alloy layer formed on the surface of the ground layer, wherein the average concentration of Sn in the Ag—Sn alloy layer is less than 10 mass %, and the concentration of Sn in the Ag—Sn alloy layer is varied with a concentration gradient so as to increase from the interface with the ground layer toward the surface layer portion of the Ag—Sn alloy layer. According to Patent Literature 1, an electrical contact material excellent in wear resistance, corrosion resistance and processability is described, and the electrical contact material is described to be able to be produced with an extremely low cost.

Patent Literature 2 discloses a material for electric/electronic components wherein on the surface of a substrate having a surface composed of Cu or a Cu alloy, through the intermediary of an intermediate layer composed of a Ni layer or a Ni alloy layer, a surface layer composed of a Sn layer or a Sn alloy layer is formed, each of these layers containing an Ag₃Sn (ε phase) compound and having a thickness of 0.5 to 20 μm. As described in Patent Literature 2, an object of the invention described in Patent Literature 2 is to provide a material for electrical/electronic components, wherein the surface layer is lower in melting point than Sn, excellent in solderability, and free from the occurrence of whisker; the joint strength of the junction formed after soldering is high and at the same time the temporal degradation of the joint strength at high temperatures is hardly caused, and hence the material is suitable for a lead material; even when the material is used in a high-temperature environment, the increase of the contact resistance is suppressed, the material does not cause the degradation of the connection reliability with the counterpart member, and hence the material is suitable as a contact material, the object also including the provision of a method for producing the above-described material, and the provision of electrical/electronic components using the above-described material.

Patent Literature 3 discloses a covering material including a base material having electrically conductive property and a covering layer formed on the base material, wherein the covering layer includes an intermetallic compound of Sn and a precious metal at least on the surface side thereof. Patent Literature 3 describes an object thereof is to provide a covering material being low in contact resistance, having a low friction coefficient so as to be effective in reduction of insertion force, being excellent in oxidation resistance and having stable properties over a long period of time, and a method for producing the covering material.

CITATION LIST Patent Literature

[Patent Literature 1] Japanese Patent Laid-Open No. Hei 4-370613 [Patent Literature 2] Japanese Patent Laid-Open No. Hei 11-350189

[Patent Literature 3] Japanese Patent Laid-Open No. 2005-126763 SUMMARY OF INVENTION Technical Problem

However, the technique described in Patent Literature 1 has not revealed the relation to the recently required reduction of the insertion force and the relation to the occurrence and nonoccurrence of the whiskers. The average concentration of Sn in the Ag—Sn alloy layer is less than 10 mass %, and the proportion of Ag in the Ag—Sn alloy layer is considerably large, and hence the gas corrosion resistance against the gases such as chlorine gas, sulfurous acid gas and hydrogen sulfide is not sufficient according to the evaluation performed by the present inventors.

In the technique described in Patent Literature 2, a surface layer is involved which is formed of a Sn layer or a Sn-alloy layer including an Ag₃Sn (ε-phase) compound and having a thickness of 0.5 to 20 μm, and according to the evaluation performed by the present inventors, this surface layer thickness has resulted in the occurrence of areas incapable of sufficiently reducing the insertion force. The content of the Ag₃Sn (ε-phase) of the surface layer formed of a Sn layer or a Sn-alloy layer is also described to be 0.5 to 5% by mass in terms of Ag, the proportion of Sn in the surface layer formed of a Sn layer or a Sn-alloy layer is large, the thickness of the surface layer formed of a Sn layer or a Sn-alloy layer, and hence, according to the evaluation performed by the present inventors, whiskers occurred and the fine sliding wear resistance was not sufficient. The heat resistance and the solder wettability were also not sufficient.

In the technique described in Patent Literature 3, the covering layer includes an intermetallic compound of Sn and a precious metal, the thickness of the intermetallic compound (Ag₃Sn) of Sn and a precious metal is preferably set at 1 μm or more and 3 μm or less, and according to the evaluation performed by the present inventors, this thickness was found to be unable to sufficiently decrease the insertion force.

As described above, electronic component metallic materials having a conventional Sn—Ag alloy/Ni base plating structure still cannot sufficiently decrease the insertion force and a problem has been left unsolved in that whiskers occur. For the durability (heat resistance, solder wettability, fine sliding wear resistance and gas corrosion resistance), it is difficult to achieve sufficiently satisfactory specifications and such specifications have not yet been clear.

The present invention has been achieved in order to solve the above-described problems, and an object of the present invention is to provide metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. Here, the adhesive wear means the wear phenomenon made to occur due to the shear, caused by frictional movement, of the adhesive portions constituting the real contact area between solid objects. With the increase of the adhesive wear, the insertion force is increased when a male terminal and a female terminal are joined together.

Solution to Problem

The present inventors made a diligent study, and consequently have discovered that a metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability can be prepared by disposing a lower layer, an intermediate layer and an upper layer in this order on a base material, using predetermined metals for the lower layer, the intermediate layer and the upper layer, respectively, and assigning predetermined thickness values and predetermined compositions to the lower, intermediate and upper layers, respectively.

An aspect of the present invention perfected on the basis of the above-described discovery is a metallic material for electronic components including: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group constituting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.40 μm; the thickness of the upper layer is 0.02 μm or more and less than 1.00 μm; and the metallic material for electronic components has low degree of whisker formation, low adhesive wear property and high durability.

In the metallic material for electronic components of the present invention in an embodiment, the minimum thickness (μm) of the upper layer is 50% or more of the thickness (μm) of the upper layer.

In the metallic material for electronic components of the present invention in another embodiment, the maximum value (μm) of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer is 50% or less of the thickness (μm) of the upper layer.

In the metallic material for electronic components of the present invention in yet another embodiment, on the surface of the upper layer, a region where the total atomic concentration (at %) of the constituent elements B≧the total atomic concentration (at %) of the constituent elements C and the atomic concentration (at %) of O≧10 at % is present in the range of 0.02 μm or less.

In the metallic material for electronic components of the present invention in yet another embodiment, the upper layer includes the metal(s) of the constituent element group B in a content of 10 to 50 at %.

In the metallic material for electronic components of the present invention in yet another embodiment, in the upper layer, ζ(zeta)-phase being a Sn—Ag alloy including Sn in a content of 11.8 to 22.9 at % is present.

In the metallic material for electronic components of the present invention in yet another embodiment, in the upper layer, an ε(epsilon)-phase being Ag₃Sn is present.

In the metallic material for electronic components of the present invention in yet another embodiment, in the upper layer, a ζ(zeta)-phase being a Sn—Ag alloy including Sn in a content of 11.8 to 22.9 at % and an ε(epsilon)-phase being Ag₃Sn are present.

In the metallic material for electronic components of the present invention in yet another embodiment, in the upper layer, only the ε(epsilon)-phase being Ag₃Sn is present.

In the metallic material for electronic components of the present invention in yet another embodiment, in the upper layer, the ε(epsilon)-phase being Ag₃Sn and β-Sn being a Sn single phase are present.

In the metallic material for electronic components of the present invention in yet another embodiment, in the upper layer, the ζ(zeta)-phase being a Sn—Ag alloy including Sn in a content of 11.8 to 22.9 at %, the ε(epsilon)-phase being Ag₃Sn and β-Sn being a Sn single phase are present.

In the metallic material for electronic components of the present invention in yet another embodiment, the intermediate layer includes a metal(s) of the constituent element group B in a content of 35 at % or more.

In the metallic material for electronic components of the present invention in yet another embodiment, in the intermediate layer, Ni₃Sn₄ and Ni₃Sn₂ are present.

In the metallic material for electronic components of the present invention in yet another embodiment, in the intermediate layer, Ni₃Sn₄ and β-Sn being a Sn single phase are present.

In the metallic material for electronic components of the present invention in yet another embodiment, the thickness ratio between the upper layer and the intermediate layer is such that upper layer:intermediate layer=9:1 to 3:7.

In the metallic material for electronic components of the present invention in yet another embodiment, in the range from the upper layer to the intermediate layer, exclusive of the range of 0.03 μm from the outermost surface of the upper layer, C, S and O are each included in a content of 2 at % or less.

In the metallic material for electronic components of the present invention in yet another embodiment, the indentation hardness of the surface of the upper layer, namely, the hardness obtained by hitting a dent on the surface of the upper layer with a load of 10 mN on the basis of a nanoindentation hardness test is 1000 MPa or more.

In the metallic material for electronic components of the present invention in yet another embodiment, the indentation hardness measured from the surface of the upper layer, namely, the hardness obtained by hitting a dent on the surface of the upper layer with a load of 10 mN on the basis of a nanoindentation hardness test is 10000 MPa or less.

In the metallic material for electronic components of the present invention, in yet another embodiment thereof, the arithmetic mean height (Ra) of the surface of the upper layer is 0.3 μm or less.

In the metallic material for electronic components of the present invention, in yet another embodiment thereof, the maximum height (Rz) of the surface of the upper layer is 3 μm or less.

In the metallic material for electronic components of the present invention in yet another embodiment, the upper layer, the intermediate layer and the lower layer are formed, by forming a film of one or two or more selected from the constituent element group A on the base material, then forming a film of one or two selected from the constituent element group C, then forming a film of one or two or more selected from the constituent element group B, and by diffusion of the respective selected elements of the constituent element group A, the constituent element group B and the constituent element group C.

In the metallic material for electronic components of the present invention in yet another embodiment, the diffusion is performed by heat treatment.

In the metallic material for electronic components of the present invention in yet another embodiment, the heat treatment is performed at a temperature equal to higher than the melting point(s) of the metal(s) of the constituent element group B, an alloy layer of one or two selected from the constituent element group B and one or two or more selected from the constituent element group A and an alloy layer of one or two selected from the constituent element group B and one or two or more selected from constituent element group C are formed.

In the metallic material for electronic components of the present invention in yet another embodiment, the content of the metal(s) of the constituent element group A is 50% by mass or more in terms of the total content of Ni, Cr, Mn, Fe, Co and Cu, and one or two or more selected from the group consisting of B, P, Sn and Zn are further included.

In the metallic material for electronic components of the present invention in yet another embodiment, the content of the metal(s) of the constituent element group B is 50% by mass or more in terms of the total content of Sn and In, and the rest alloy component is composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn.

In the metallic material for electronic components of the present invention in yet another embodiment, the content of the metal(s) of the constituent element group C is 50% by mass or more in terms of the total content of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and the rest alloy component is composed of one or two or more selected from the group consisting of Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl and Zn.

In the metallic material for electronic components of the present invention, in yet another embodiment thereof, the Vickers hardness of the cross section of the lower layer is Hv 300 or more.

In the metallic material for electronic components of the present invention in yet another embodiment, the indentation hardness of the cross section of the lower layer, namely, the hardness obtained by hitting a dent on the cross section of the lower layer with a load of 10 mN on the basis of a nanoindentation hardness test is 1500 MPa or more.

In the metallic material for electronic components of the present invention, in yet another embodiment thereof, the Vickers hardness of the cross section of the lower layer is Hv 1000 or less.

In the metallic material for electronic components of the present invention in yet another embodiment, the indentation hardness of the cross section of the lower layer, namely, the hardness obtained by hitting a dent on the cross section of the lower layer with a load of 10 mN on the basis of a nanoindentation hardness test is 10000 MPa or less.

In the metallic material for electronic components of the present invention in yet another embodiment, the intermediate layer is constituted with Ni₃Sn and Ni₃Sn₂.

In the metallic material for electronic components of the present invention in yet another embodiment, the intermediate layer is constituted with Ni₃Sn₂.

In the metallic material for electronic components of the present invention in yet another embodiment, the intermediate layer is constituted with Ni₃Sn₄.

In the metallic material for electronic components of the present invention in yet another embodiment, there is disposed, between the lower layer and the intermediate layer, a layer constituted with the alloy of the metal(s) of the constituent element group A and the metal(s) of the constituent element group C.

In the metallic material for electronic components of the present invention in yet another embodiment, P is deposited on the surface of the upper layer, and the deposition amount of P is 1×10⁻¹¹ to 4×10⁻⁸ mol/cm².

In the metallic material for electronic components of the present invention in yet another embodiment, N is further deposited on the surface of the upper layer, and the deposition amount of N is 2×10⁻¹² to 8×10⁻⁹ mol/cm².

In the metallic material for electronic components of the present invention in yet another embodiment, in the XPS analysis performed for the upper layer, with I(P2s) denoting the photoelectron detection intensity due to the 2S orbital electron of P to be detected and I(N1s) denoting the photoelectron detection intensity due to the 1S orbital electron of N to be detected, the relation 0.1≦I(P2s)/I(N1s)≦1 is satisfied.

In the metallic material for electronic components of the present invention in yet another embodiment, in the XPS analysis performed for the upper layer, with I(P2s) denoting the photoelectron detection intensity due to the 2S orbital electron of P to be detected and I(N1s) denoting the photoelectron detection intensity due to the 1S orbital electron of N to be detected, the relation 1<I(P2s)/I(N1s)≦50 is satisfied.

Another aspect of the present invention is a method for producing the metallic material for electronic components, the metallic material comprising: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, wherein the surface of the metallic material is surface-treated with a phosphoric acid ester-based solution including at least one of the phosphoric acid esters represented by the following general formulas [1] and [2], and at least one selected from the group of the cyclic organic compounds represented by the following general formulas [3] and [4]:

(wherein, in formulas [1] and [2], R₁ and R₂ each represent a substituted alkyl group and M represents a hydrogen atom or an alkali metal atom,)

(wherein, in formulas [3] and [4], R₁ represents a hydrogen atom, an alkyl group or a substituted alkyl group; R₂ represents an alkali metal atom, a hydrogen atom, an alkyl group or a substituted alkyl group; R₃ represents an alkali metal atom or a hydrogen atom; R₄ represents —SH, an alkyl group-substituted or aryl group-substituted amino group, or represents an alkyl-substituted imidazolylalkyl group; and R₅ and R₆ each represent —NH₂, —SH or —SM (M represents an alkali metal atom).)

In the method for producing metallic material for electronic components of the present invention in an embodiment, the surface treatment with the phosphoric acid ester-based solution is performed by applying the phosphoric acid ester-based solution to the upper layer.

In the method for producing metallic material for electronic components of the present invention in another embodiment, the surface treatment with the phosphoric acid ester-based solution is performed by conducting an electrolysis by immersing the metallic material after the formation of the upper layer in the phosphoric acid ester-based solution and using as the anode the metallic material after the formation of the upper layer.

The present invention is, in yet another aspect thereof, a connector terminal using, in the contact portion thereof, the metallic material for electronic components of the present invention.

The present invention is, in yet another aspect thereof, a connector using the connector terminal of the present invention.

The present invention is, in yet another aspect thereof, an FFC terminal using, in the contact portion thereof, the metallic material for electronic components of the present invention.

The present invention is, in yet another aspect thereof, an FPC terminal using, in the contact portion thereof, the metallic material for electronic components of the present invention.

The present invention is, in yet another aspect thereof, an FFC using the FFC terminal of the present invention.

The present invention is, in yet another aspect thereof, an FPC using the FPC terminal of the present invention.

The present invention is, in yet another aspect thereof, an electronic component using, in the electrode thereof for external connection, the metallic material for electronic components of the present invention.

The present invention is, in yet another aspect thereof, an electronic component using the metallic material for electronic components of the present invention, in a push-in type terminal thereof for fixing a board connection portion to a board by pushing the board connection portion into the through hole formed in the board, wherein a female terminal connection portion and the board connection portion are provided respectively on one side and the other side of a mounting portion to be attached to a housing.

Advantageous Effects of Invention

According to the present invention, it is possible to provide metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram illustrating the structure of a metallic material for electronic components according to an embodiment of the present invention.

FIG. 2 is an XPS analysis chart of a metallic material for electronic components according to the present invention.

FIG. 3 is a graph showing the relation between the deposition amounts and the detection intensities of the components of the post treatment solution of a metallic material for electronic components according to the present invention.

FIG. 4 is a schematic diagram of the HAADF (High-Angle-Annular-Dark-Filed)-STEM (scanning transmission electron microscope) image of a metallic material for electronic components according to the present invention.

FIG. 5 is a schematic diagram of the STEM (scanning transmission electron microscope) line analysis results of a metallic material for electronic components according to the present invention.

FIG. 6 is the phase diagram of Sn—Ag.

FIG. 7 is the phase diagram of Sn-Ni.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the metallic materials for electronic components according to the embodiments of the present invention are described. As shown in FIG. 1, the metallic material 10 for electronic components according to an embodiment includes a base material 11, an lower layer 12 formed on the base material 11, an intermediate layer 13 formed on the lower layer 12 and an upper layer 14 formed on the intermediate layer 13.

<Structure of Metallic Material for Electronic Components>

(Base Material)

Usable examples of the base material 11 include, without being particularly limited to: metal base materials such as copper and copper alloys, Fe-based materials, stainless steel, titanium and titanium alloys and aluminum and aluminum alloys. The base material 11 may be formed by combining a metal base material with a resin layer. Examples of the base material formed by combining a metal base material with a resin layer include the electrode portions in FPC and FFC base materials.

(Upper Layer)

The upper layer 14 is required to be constituted with an alloy composed of one or two selected from a constituent element group B, namely, the group consisting of Sn and In, and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir.

Sn and In are oxidizable metals, but are characterized by being relatively soft among metals. Accordingly, even when an oxide film is formed on the surface of Sn or In, for example at the time of joining together a male terminal and a female terminal by using a metallic material for electronic components as a contact material, the oxide film is easily scraped to result in contact between metals, and hence a low contact resistance is obtained.

Sn and In are excellent in the gas corrosion resistance against the gases such as chlorine gas, sulfurous acid gas and hydrogen sulfide gas; for example, when Ag poor in gas corrosion resistance is used for the upper layer 14, Ni poor in gas corrosion resistance is used for the lower layer 12, and copper or a copper alloy poor in gas corrosion resistance is used for the base material 11, Sn and In have an effect to improve the gas corrosion resistance of the metallic material for electronic components. As for Sn and In, Sn is preferable because In is severely regulated on the basis of the technical guidelines for the prevention of health impairment prescribed by the Ordinance of Ministry of Health, Labour and Welfare.

Ag, Au, Pt, Pd, Ru, Rh, Os and Ir are characterized by being relatively heat-resistant among metals. Accordingly, these metals suppress the diffusion of the composition of the base material 11, the lower layer 12 and the intermediate layer 13 toward the side of the upper layer 14 to improve the heat resistance. These metals also form compounds with Sn or In in the upper layer 14 to suppress the formation of the oxide film of Sn or In, so as to improve the solder wettability. Among Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, Ag is more desirable from the viewpoint of electrical conductivity. Ag is high in electrical conductivity. For example, when Ag is used for high-frequency wave signals, impedance resistance is made low due to the skin effect.

The thickness of the upper layer 14 is required to be 0.02 μm or more and less than 1.00 μm. When the thickness of the upper layer 14 is less than 0.02 μm, the composition of the base material 11 or the lower layer 12 tends to diffuse to the side of the upper layer 14 and the heat resistance or the solder wettability is degraded. Additionally, the upper layer is worn by fine sliding, and the lower layer 12 high in contact resistance tends to be exposed, and hence the fine sliding wear resistance is poor and the contact resistance tends to be increased by fine sliding. Moreover, the lower layer 12 poor in gas corrosion resistance tends to be exposed, and hence the gas corrosion resistance is poor, and the exterior appearance is discolored when a gas corrosion test is performed. On the other hand, when the thickness of the upper layer 14 is 1.00 μm or more, the thin film lubrication effect due to the hard base material 11 or the hard lower layer 12 is degraded and the adhesive wear is increased. The mechanical durability is also degraded and scraping of plating tends to occur.

The upper layer 14 preferably includes the metal(s) of the constituent element group B in a content of 10 to 50 at %. When the content of the metal(s) of the constituent element group B is less than 10 at %, for example, in the case where the metal of the constituent element group C is Ag, the gas corrosion resistance is poor, and sometimes the exterior appearance is discolored when a gas corrosion test is performed. On the other hand, when the content of the metal(s) of the constituent element group B exceeds 50 at %, the proportion of the metal(s) of the constituent element group B in the upper layer 14 is large, and hence the adhesive wear is increased and whiskers also tend to occur. Moreover, the fine sliding wear resistance is sometimes poor.

In the upper layer 14, the ζ(zeta)-phase being a Sn—Ag alloy including Sn in a content of 11.8 to 22.9 at % is preferably present. By the presence of the ζ(zeta)-phase, the gas corrosion resistance is improved, and the exterior appearance is hardly discolored even when the gas corrosion test is performed.

In the upper layer 14, the ζ(zeta)-phase and the ε(epsilon)-phase being Ag₃Sn are preferably present. By the presence of the ε(epsilon)-phase, as compared with the case where only the ζ(zeta)-phase is present in the upper layer 14, the coating becomes harder and the adhesive wear is decreased. The increase of the proportion of Sn in the upper layer 14 improves the gas corrosion resistance.

In the upper layer 14, preferably only the ε(epsilon)-phase being Ag₃Sn is present. By the sole presence of the ε(epsilon)-phase in the upper layer 14, the coating becomes further harder and the adhesive wear is decreased as compared with the case where the ζ(zeta)-phase and the ε(epsilon)-phase being Ag₃Sn are present in the upper layer 14. The more increase of the proportion of Sn in the upper layer 14 also improves the gas corrosion resistance.

The presence of the ε(epsilon)-phase being Ag₃Sn and the β-Sn being a Sn single phase in the upper layer 14 is preferable. By the presence of the ε(epsilon)-phase being Ag₃Sn and β-Sn being a Sn single phase, the gas corrosion resistance is improved with a furthermore increase of the proportion of Sn in the upper layer as compared with the case where only the ε(epsilon)-phase is present in the upper layer 14.

In the upper layer 14, preferably the ζ(zeta)-phase being a Sn—Ag alloy including Sn in a content of 11.8 to 22.9 at %, the ε(epsilon)-phase being Ag₃Sn and β-Sn being a Sn single phase are present. By the presence of the ζ(zeta)-phase, the ε(epsilon)-phase being Ag₃Sn and β-Sn being a Sn single phase, the gas corrosion resistance is improved, the exterior appearance is hardly discolored even when a gas corrosion test is performed, and the adhesive wear is decreased. The composition concerned is created by diffusion and involves no structure in an equilibrium state.

The upper layer 14 should not be present as solely composed of β-Sn. When the upper layer 14 is present as solely composed of β-Sn, the adhesive wear is significant, whiskers occur and, for example, the heat resistance and the fine sliding wear resistance are degraded.

(Intermediate Layer)

Between the lower layer 12 and the upper layer 14, the intermediate layer 13 constituted with one or two or more selected from the constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu, and one or two selected from the constituent element group B, namely, the group consisting of Sn and In is required to be formed in a thickness of 0.01 μm or more and less than 0.40 μm. Sn and In are excellent in the gas corrosion resistance against chlorine gases such as sulfurous acid gas and hydrogen sulfide gas; for example, when Ni poor in gas corrosion resistance is used for the lower layer 12 and copper and copper alloy poor in gas corrosion resistance is used for the base material 11, Sn and In have a function to improve the gas corrosion resistance of the metallic material for electronic components. Ni, Cr, Mn, Fe, Co and Cu provide a harder coating as compared with Sn and In, accordingly make the adhesive wear hardly occur, prevent the diffusion of the constituent metal(s) of the base material 11 into the upper layer 14, and thus improve the durability in such a way that the degradation of the heat resistance or the degradation of the solder wettability is suppressed.

When the thickness of the intermediate layer 13 is 0.01 μm or more, the coating becomes hard and the adhesive wear is decreased. On the other hand, the thickness of the intermediate layer 13 is 0.40 μm or more, the bending processability is degraded, the mechanical durability is also degraded, and sometimes scraping of plating occurs.

Of Sn and In, Sn is preferable because In is severely regulated on the basis of the technical guidelines for the prevention of health impairment prescribed by the Ordinance of Ministry of Health, Labour and Welfare. Ni is preferable among Ni, Cr, Mn, Fe, Co and Cu. This is because Ni is hard, and accordingly the adhesive wear hardly occurs and sufficient bending processability is obtained.

In the intermediate layer 13, the content of the metal(s) of the constituent element group B is preferably 35 at % or more. When the content of Sn is 35 at % or more, sometimes the coating becomes hard and the adhesive wear is decreased.

The intermediate layer 13 may be constituted with Ni₃Sn and Ni₃Sn₂, or may also be constituted with Ni₃Sn₂ or Ni₃Sn₄ alone. The presence of Ni₃Sn, Ni₃Sn₂ or Ni₃Sn₄ sometimes improves the heat resistance or the solder wettability.

In the intermediate layer 13, Ni₃Sn₄ and β-Sn being a Sn single phase are preferably present. The presence of Ni₃Sn₄ and β-Sn sometimes improves the heat resistance or the solder wettability as compared with the case where Ni₃Sn₄ and Ni₃Sn₂ are present.

(Relation Between Thickness of Upper Layer and Minimum Thickness of Upper Layer)

The minimum thickness (μm) of the upper layer 14 preferably accounts for 50% or more of the thickness (m) of the upper layer 14. When the minimum thickness of the upper layer 14 is less than 50% of the thickness of the upper layer 14, the surface roughness of the upper layer 14 is rough, Ni high in contact resistance, hardly wettable with solder and poor in gas corrosion resistance is exposed to the surface, and hence sometimes the heat resistance, the solder wettability and the gas corrosion resistance are degraded.

Here, the spot for grasping the relation between the thickness of the upper layer 14 and the minimum thickness of the upper layer 14 is the average cross section of the portion exhibiting the effect of the coating of the present invention. The spot refers to the portion normally subjected to film formation processing in the normal surface profile (oil pits, etch pits, scratches, dents, and other surface defects are not included) of the material, in the portion concerned. Needless to say, the spot excludes the deformed potions or the like due to the press processing before and after the film formation.

(Relation Between Thickness of Upper Layer and Maximum Value of Elevation Differences Between Adjacent Hills and Valleys in Profile of Interface between Upper Layer and Intermediate Layer)

The maximum value (μm) of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer 14 and the intermediate layer 13 preferably accounts for 50% or less of the thickness (μm) of the upper layer 14. When the maximum value (μm) of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer 14 and the intermediate layer 13 exceeds 50% of the thickness of the upper layer 14, the intermediate layer 13 is to be positioned near the upper layer 14, Ni high in contact resistance, hardly wettable with solder and poor in gas corrosion resistance tends to be exposed to the surface, and hence sometimes the heat resistance, solder wettability and gas corrosion are degraded.

The microscopic distribution of the thickness of the upper layer 14 and the profile of the interface between the upper layer 14 and the intermediate layer 13 can be controlled by the film formation conditions of the lower layer 12, intermediate layer 13 and upper layer 14. At the time of film formation, by regulating the plating conditions (metal concentration, additives, cathode current density, stirring and the like), smooth electrodeposition film formation is performed so as to satisfy the above-described “relation between the thickness of the upper layer and the minimum thickness of the upper layer,” and the above-described “relation between the thickness of the upper layer and the maximum value of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer.”

(Thickness Ratio Between Upper Layer and Intermediate Layer, and Composition)

The thickness ratio between the upper layer 14 and the intermediate layer 13 is preferably such that upper layer/intermediate layer=9:1 to 3:7. When the proportion of the upper layer exceeds 9/10, the thin film lubrication effect due to the intermediate layer 13 harder than the hard base material 11, lower layer 12 and upper layer 14 is degraded and the adhesive wear is increased. On the other hand, when the proportion of the upper layer is less than 3/10, Ni high in contact resistance, hardly wettable with solder and poor in gas corrosion resistance tends to be exposed to the surface, and hence sometimes the heat resistance, solder wettability, fine sliding wear resistance and gas corrosion are degraded.

In the range from the upper layer 14 to the intermediate layer 13, exclusive of the range of 0.03 μm from the outermost surface of the upper layer 14, C, S and O are each included preferably in a content of 2 at % or less. When the content of each of C, S and O is larger than 2 at %, these co-deposited elements are gasified in the application of heat treatment, and no uniform alloy coating may be able to be formed.

(Lower Layer)

Between the base material 11 and the upper layer 14, it is necessary to form the lower layer 12 constituted with one or two or more selected from the constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu. By forming the lower layer 12 with one or two or more metals selected from the constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu, the hard lower layer 12 is formed, hence the thin film lubrication effect is improved and the adhesive wear is decreased, and the lower layer 12 prevents the diffusion of the constituent metal(s) of the base material 11 into the upper layer 14 and improves, for example, the heat resistance or the solder wettability.

The thickness of the lower layer 12 is required to be 0.05 μm or more. When the thickness of the lower layer 12 is less than 0.05 μm the thin film lubrication effect due to the hard lower layer is degraded and the adhesive wear is increased. The diffusion of the constituent metal(s) of the base material 11 into the upper layer 14 is facilitated, and the heat resistance or the solder wettability is degraded. On the other hand, the thickness of the lower layer 12 is required to be less than 5.00 μm. When the thickness is 5.00 μm or more, bending processability is poor.

On the surface of the upper layer 14, a region where the total atomic concentration (at %) of the constituent elements B≧the total atomic concentration (at %) of the constituent elements C and the atomic concentration (at %) of O≧10 at % is preferably present in the range of 0.02 μm or less. The constituent elements B such as Sn has affinity with O, and hence the surface is bonded to O after Sn plating. Even when heat treatment is applied, the oxide of Sn formed by this bonding does not undergo Sn—Ag alloying and maintains the state before the heat treatment, the above-described region is present. However, when the region concerned exceeds the range of 0.02 μm, sometimes the contact resistance or the solder wettability is degraded.

Between the lower layer 12 and the intermediate layer 13, a layer constituted with the metal(s) of the constituent element group A and the metal(s) of the constituent element group C may also be provided. As the layer concerned, for example, a Ni—Ag alloy layer is preferable. When such a layer is formed between the lower layer 12 and the intermediate layer 13, the diffusion of the constituent metal(s) of the base material 11 into the upper layer 14 is further satisfactorily prevented, and for example, the heat resistance or the solder wettability is improved.

(Constituent Element Group A)

The metal(s) of the constituent element group A includes Ni, Cr, Mn, Fe, Co and Cu in the total amount of these of 50 mass % or more, and may further include one or two or more selected from the group consisting of B, P, Sn and Zn. The alloy composition of the lower layer 12 having such a constitution as described above makes the lower layer 12 harder and further improves the thin film lubrication effect to further decrease the adhesive wear; the alloying of the lower layer 12 further prevents the diffusion of the constituent metals of the base material 11 into the upper layer, and sometimes improves the durability such as the heat resistance and the solder wettability in such a way.

(Constituent Element Group B)

The content of the metal(s) of the constituent element group B is 50% by mass or more in terms of the total content of Sn and In, and the rest alloy component may be composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn. Sometimes, these metals further decreases the adhesive wear, suppresses the occurrence of whisker, and additionally improves the durability such as the heat resistance or the solder wettability.

(Constituent Element Group C)

The content of the metal(s) of the constituent element group C is 50% by mass or more in terms of the total content of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and the rest alloy component may be composed of one or two or more selected from the group consisting of Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl and Zn. Sometimes, these metals further decreases the adhesive wear, suppresses the occurrence of whisker, and additionally improves the durability such as the heat resistance or the solder wettability.

(Diffusion Treatment)

The upper layer 14, the intermediate layer 13 and the lower layer 12 may be formed, by forming a film of one or two or more selected from the constituent element group A on the base material, then forming a film of one or two selected from the constituent element group C, then forming a film of one or two or more selected from the constituent element group B, and by diffusion of the respective selected elements of the constituent element group A, the constituent element group B and the constituent element group C. For example, when the metal from the constituent element group B is Sn and the metal from the constituent element group C is Ag, the diffusion of Ag into Sn is fast, and thus a Sn—Ag alloy layer is formed by spontaneous diffusion of Sn. The formation of the alloy layer can further reduce the adhesion force of Sn, and the low degree of whisker formation and the durability can also be further improved.

(Heat Treatment)

After the formation of the upper layer 14, a heat treatment may be applied for the purpose of further suppressing the adhesive wear and further improving the low degree of whisker formation and the durability. The heat treatment allows the metal(s) of the constituent element group B and the metal(s) of the constituent element group C of the upper layer 14 to form an alloy layer more easily, also allows the metal(s) of the constituent element group A and the metal(s) of the constituent element group B of the intermediate layer 13 to form an alloy layer more easily, further reduces the adhesion force of Sn, and can further improve the low degree of whisker formation and the durability.

For the heat treatment, the treatment conditions (temperature×time) can be appropriately selected. The heat treatment is not particularly required to be applied. When the heat treatment is applied, the heat treatment performed at a temperature equal to or higher than the highest melting point of the metal(s) selected from the constituent element group B allows the metal(s) of the constituent element group B and the metal(s) of the constituent element group C of the upper layer 14 to form an alloy layer more easily, and also allows the metal(s) of the constituent element group A and the metal(s) of the constituent element group B of the intermediate layer 13 to form an alloy layer more easily.

(Post-Treatment)

To the upper layer 14, or to the upper layer 14 after being subjected to heat treatment, a post-treatment may be applied for the purpose of further decreasing the adhesive wear and improving the low degree of whisker formation and the durability. The post-treatment improves the lubricity, further decreases the adhesive wear, suppress the oxidation of the upper layer 14, and can improve the durability such as the heat resistance or the solder wettability. Specific examples of the post-treatment include phosphoric acid salt treatment, lubrication treatment and silane coupling treatment using an inhibitor. For the post-treatment, the treatment conditions (temperature×time) can be appropriately selected. The post-treatment is not particularly required to be applied.

The post-treatment is preferably performed for the surface of the upper layer 14 by using an aqueous solution (referred to as the phosphoric acid ester-based solution) including one or two or more phosphoric acid esters and one or two or more cyclic organic compounds. The phosphoric acid ester(s) added to the phosphoric acid ester-based solution plays the functions as an antioxidant for plating and a lubricant for plating. The phosphoric acid esters used in the present invention are represented by the general formula [1] and [2]. Examples of the preferable compounds among the compounds represented by the general formula [1] include lauryl acidic phosphoric acid monoester. Examples of the preferable compounds among the compounds represented by the general formula [2] include lauryl acidic phosphoric acid diester.

(wherein, in formulas [1] and [2], R₁ and R₂ each represent a substituted alkyl group and M represents a hydrogen atom or an alkali metal atom.)

The cyclic organic compound added to the phosphoric acid ester-based solution plays the function as an antioxidant for plating. The group of the cyclic organic compounds used in the present invention are represented by the general formula [3] and [4]. Examples of the preferable compounds among the cyclic organic compounds represented by the general formulas [3] and [4] include: mercaptobenzothiazole, Na salt of mercaptobenzothiazole, K salt of mercaptobenzothiazole, benzotriazole, 1-methyltriazole, tolyltriazole and triazine-based compounds.

(wherein, in formulas [3] and [4], R₁ represents a hydrogen atom, an alkyl group or a substituted alkyl group; R₂ represents an alkali metal atom, a hydrogen atom, an alkyl group or a substituted alkyl group; R₃ represents an alkali metal atom or a hydrogen atom; R₄ represents —SH, an alkyl group-substituted or aryl group-substituted amino group, or represents an alkyl-substituted imidazolylalkyl group; and R₅ and R₆ each represent —NH₂, —SH or —SM (M represents an alkali metal atom).)

The post-treatment is furthermore preferably performed in such a way that both P and N are present on the surface of the upper layer 14. When P is absent on the plating surface, the solderability tends to be degraded, and the lubricity of the plating material is also degraded. On the other hand, when N is absent on the Sn or Sn alloy plating surface, sometimes the contact resistance of the plating material tends to be increased in a high temperature environment.

Moreover, in the present invention, in the case where P is deposited on the surface of the upper layer 14, when the deposition amount of P is 1×10⁻¹¹ to 4×10⁻⁸ mol/cm², preferably the solderability is hardly degraded, the lubricity is satisfactory and the increase of the contact resistance is also reduced. In the case where N is additionally deposited on the surface of the upper layer 14, more preferably the deposition amount of N is 2×10⁻¹² to 8×10⁻⁹ mol/cm². When the deposition amount of P is less than 1×10⁻¹¹ mol/cm², the solder wettability tends to be degraded, and when the deposition amount of P exceeds 4×10⁻⁸ mol/cm², sometimes the failure of the increase of the contact resistance occurs.

When in the XPS analysis performed for the upper layer 14, with I(P2s) denoting the photoelectron detection intensity due to the 2S orbital electron of P to be detected and I(N1s) denoting the photoelectron detection intensity due to the 1S orbital electron of N to be detected, the relation 0.1≦I(P2s)/I(N1s)≦1 is satisfied, sometimes the contact resistance and the solderability of the plating material is hardly degraded in a high temperature environment. When the value of I(P2s)/I(N1s) is less than 0.1, for example, the function to prevent the contact resistance degradation is not sufficient, and when the value of I(P2s)/I(N1s) exceeds 1, the contact resistance at the early stage comes to be slightly high, but, as described below, sometimes the dynamic friction coefficient of the plating material comes to be small. In this case, I(P2s) and I(N1s) more preferably satisfy the relation 0.3≦I(P2s)/I(N1s)≦0.8.

When in the XPS analysis performed, in the same manner as described above, for the upper layer 14, with I(P2s) denoting the photoelectron detection intensity due to the 2S orbital electron of P to be detected and I(N1s) denoting the photoelectron detection intensity due to the 1S orbital electron of N to be detected, the relation 1≦I(P2s)/I(N1s)≦50 is satisfied, sometimes the dynamic friction coefficient of the plating material comes to be small and the insertion force of terminals and connectors comes to be low. When the value of I(P2s)/I(N1s) is 1 or less, the insertion force comes to be slightly high, and when the value of I(P2s)/I(N1s) exceeds 50, the insertion force comes to be low, but sometimes the contact resistance at the early stage comes to be high and the solderability at the early stage is also degraded. In this case, I(P2s) and I(N1s) more preferably satisfy the relation 5<I(P2s)/I(N1s)≦40.

The concentration of the phosphoric acid ester(s) for obtaining the deposition amounts of the post-treatment solution components on the surface of the upper layer 14 of the present invention is 0.1 to 10 g/L, and preferably 0.5 to 5 g/L. On the other hand, the concentration of the cyclic organic compound(s) is, in relation to the total volume of the treatment solution, 0.01 to 1.0 g/L and preferably 0.05 to 0.6 g/L.

The phosphoric acid ester-based solution is an aqueous solution having the above-described components, and when the solution is heated to increase the temperature of the solution to 40 to 80° C., the emulsification of the components into water proceed faster, and the drying of the materials after the treatment is facilitated.

The surface treatment may also be performed by applying the phosphoric acid ester-based solution to the surface of the upper layer 14 after the formation of the upper layer 14. Examples of the method for applying the solution concerned include: spray coating, flow coating, dip coating and roll coating; from the viewpoint of productivity, dip coating or spray coating is preferable. On the other hand, as another treatment method, the surface treatment with the phosphoric acid ester-based solution may also be performed by conducting an electrolysis by immersing the metallic material after the formation of the upper layer 14 in the phosphoric acid ester-based solution and using as the anode the metallic material after the formation of the upper layer 14. The metallic material subjected to the treatment based on this method offers an advantage that the contact resistance in a high temperature environment is more hardly increased.

The hitherto presented description of the surface treatment with the phosphoric acid ester-based solution may be performed either after the formation of the upper layer 14 or after the reflow treatment subsequent to the formation of the upper layer 14. The surface treatment is not particularly temporarily limited, but from industrial viewpoint, the surface treatment is preferably performed as a sequence of steps.

<Properties of Metallic Material for Electronic Components>

The indentation hardness of the surface of the upper layer 14, namely, the hardness obtained by hitting a dent on the surface of the upper layer 14 with a load of 10 mN on the basis of a nanoindentation hardness test is preferably 1000 MPa or more. The indentation hardness being 1000 MPa or more improves the thin film lubrication effect due to the hard upper layer 14, and decreases the adhesive wear. The indentation hardness of the surface of the upper layer 14 is preferably 10000 MPa or less. The indentation hardness of the surface of the upper layer 14 being 10000 MPa improves the bending processability, makes cracks hardly occur in the molded portion when the metallic material for electronic components of the present invention is subjected to press molding, and consequently suppresses the degradation of the gas corrosion resistance.

The arithmetic mean height (Ra) of the surface of the upper layer 14 is preferably 0.3 μm or less. The arithmetic mean height (Ra) of the surface of the upper layer 14 being 0.3 μm or less reduces the raised portions of the surface relatively tending to be corroded, thus smoothes the surface and improves the gas corrosion resistance.

The maximum height (Rz) of the surface of the upper layer 14 is preferably 3 μm or less. The maximum height (Rz) of the surface of the upper layer 14 being 3 μm or less reduces the raised portions relatively tending to be corroded, thus smoothes the surface and improves the gas corrosion resistance.

The Vickers hardness of the lower layer 12 is preferably Hv 300 or more. The Vickers hardness of the lower, layer 12 being Hv 300 or more makes the lower layer harder and further improves the thin film lubrication effect to further decrease the adhesive wear. On the other hand, the Vickers hardness Hv1000 of the lower layer 12 is preferably Hv 1000 or less. The Vickers hardness of the lower layer 12 being Hv 1000 or less improves the bending processability, makes cracks hardly occur in the molded portion when the metallic material for electronic components of the present invention is subjected to press molding, and consequently suppresses the degradation of the gas corrosion resistance.

The indentation hardness of the cross section of the lower layer 12 is preferably 1500 MPa or more. The indentation hardness of the cross section of the lower layer 12 being 1500 MPa or more makes the lower layer harder and further improves the thin film lubrication effect and decreases the adhesive wear. On the other hand, the indentation hardness of the cross section of the lower layer 12 is preferably 10000 MPa or less. The indentation hardness of the cross section of the lower layer 12 being 10000 MPa or less improves the bending processability, makes cracks hardly occur in the molded portion when the metallic material for electronic components of the present invention is subjected to press molding, and consequently suppresses the degradation of the gas corrosion resistance.

<Applications of Metallic Material for Electronic Components>

Examples of the application of the metallic material for electronic components of the present invention include, without being particularly limited to: a connector terminal using, in the contact portion thereof, the metallic material for electronic components, an FFC terminal or an FPC terminal using, in the contact portion thereof, the metallic material for electronic components, and an electronic component using, in the electrode thereof for external connection, the metallic material for electronic components. The terminal does not depend on the connection mode on the wiring side as exemplified by a crimp-type terminal, a soldering terminal and a press-fit terminal. Examples of the electrode for external connection include a connection component prepared by applying a surface treatment to a tab, and material surface treated for use in under bump metal of a semiconductor.

Connectors may also be prepared by using such connector terminals formed as described above, and an FFC or an FPC may also be prepared by using an FFC terminal or an FPC terminal.

The metallic material for electronic components of the present invention may also be used in a push-in type terminal for fixing a board connection portion to a board by pushing the board connection portion into the through hole formed in the board, wherein a female terminal connection portion and the board connection portion are provided respectively on one side and the other side of a mounting portion to be attached to a housing.

In a connector, both of the male terminal and the female terminal may be made of the metallic material for electronic components of the present invention, or only one of the male terminal and the female terminal may be made of the metallic material for electronic components of the present invention. The use of the metallic material for electronic components of the present invention for both of the male terminal and the female terminal further improves the low degree of insertion/extraction force.

<Method for Producing Metallic Material for Electronic Components>

As the method for producing the metallic material for electronic components of the present invention, for example, either a wet plating (electroplating or electroless plating) or a dry plating (sputtering or ion plating) can be used.

EXAMPLES

Hereinafter, both Examples of the present invention and Comparative Examples are presented; these Examples and Comparative Examples are provided for better understanding of the present invention, and are not intended to limit the present invention.

As Examples, Reference Examples and Comparative Examples, under the conditions shown in Table 1, the surface treatment was performed in the sequence of electrolytic degreasing, acid cleaning, first plating, second plating, third plating and heat treatment.

(Materials)

(1) Plate: thickness: 0.30 mm, width: 30 mm, component: Cu-30Zn

(2) Male terminal: thickness: 0.64 mm, width: 2.3 mm, component: Cu-30Zn

(3) Push-in type terminal: Press-fit terminal PCB connector, R800, manufactured by Tokiwa & Co., Inc.

(First Plating Conditions)

(1) Semi-Glossy Ni Plating

Surface treatment method: Electroplating

Plating solution: Ni sulfamate plating solution+saccharin

Plating temperature: 55° C.

Electric current density: 0.5 to 4 A/dm²

-   -   (2) Glossy Ni Plating

Surface treatment method: Electroplating

Plating solution: Ni sulfamate plating solution+saccharin+additives

Plating temperature: 55° C.

Electric current density: 0.5 to 4 A/dm²

(3) Cu Plating

Surface treatment method: Electroplating

Plating solution: Cu sulfate plating solution

Plating temperature: 30° C.

Electric current density: 0.5 to 4 A/dm²

(4) Matte Ni Plating

Surface treatment method: Electroplating

Plating solution: Ni sulfamate plating solution

Plating temperature: 55° C.

Electric current density: 0.5 to 4 A/dm²

(5) Ni-Plating

Surface treatment method: Electroplating

Plating solution: Ni sulfamate plating solution+phosphite

Plating temperature: 55° C.

Electric current density: 0.5 to 4 A/dm²

(Second Plating Conditions)

(1) Ag Plating

Surface treatment method: Electroplating

Plating solution: Ag cyanide plating solution

Plating temperature: 40° C.

Electric current density: 0.2 to 4 A/dm²

(2) Sn Plating

Surface treatment method: Electroplating

Plating solution: Sn methanesulfonate plating solution

Plating temperature: 40° C.

Electric current density: 0.5 to 4 A/dm²

(Third Plating Conditions)

(1) Sn Plating Conditions

Surface treatment method: Electroplating

Plating solution: Sn methanesulfonate plating solution

Plating temperature: 40° C.

Electric current density: 0.5 to 4 A/dm²

(Heat Treatment)

The heat treatment was performed by placing the sample on a hot plate, and verifying that the surface of the hot plate reached the predetermined temperature.

(Post-Treatment)

For Examples 25 to 40, relative to Example 1, additionally a phosphoric acid ester-based solution was used as a surface treatment solution, application based on immersion or anode electrolysis (2 V, potentiostatic electrolysis) was performed, and thus the surface treatment of the plating surface was performed. The surface treatment conditions in this case are shown in Table 2 presented below. After these treatments, the samples were dried with warm air. For the determination of the amounts of P and N deposited on the plating surface, first by using several samples having known deposition amounts, a quantitative analysis based on XPS (X-ray photoelectron analysis method) was performed, and the detection intensities (number of counts detected in 1 second) of P(2 s orbital) and N(1 s orbital) were measured. Next, on the basis of the thus obtained results, the relations between the deposition amounts and the detection intensities were derived, and from these relations, the deposition amounts of P and N of unknown samples were determined. FIG. 2 shows an example of the XPS analysis results, and FIG. 3 shows the relations between the deposition amounts of the post-treatment solution components and the XPS detection intensities (the unit of the deposition amount of P=1.1×10⁻⁹ mol/cm²; the unit of the deposition amount of N=7.8×10⁻¹¹ mol/cm²).

(Determination of Structures [Compositions] and Measurement of Thicknesses of Upper Layer and Intermediate Layer)

The determination of the structures and the measurement of the thicknesses of the upper layer and the intermediate layer of each of the obtained samples were performed by the line analysis based on the STEM (scanning transmission electron microscope) analysis. The analyzed elements are the elements in the compositions of the upper layer and the intermediate layer, and C, S and O. These elements are defined as the specified elements. On the basis of the total concentration of the specified elements defined as 100%, the concentrations (at %) of the respective elements were analyzed. The thickness corresponds to the distance determined from the line analysis (or area analysis). As the STEM apparatus, the JEM-2100F manufactured by JEOL Ltd. was used. The acceleration voltage of this apparatus is 200 kV.

In the determination of the structures and measurement of the thicknesses of the upper layer and the intermediate layer of each of the obtained samples, the evaluations were performed for arbitrary 10 points and the resulting values were averaged.

(Measurement of Thickness of Lower Layer)

The thickness of the lower layer was measured with the X-ray fluorescent analysis thickness meter (SEA5100, collimator: 0.1 mmΦ, manufactured by Seiko Instruments Inc.).

In the measurement of the thickness of the lower layer, the evaluations were performed for arbitrary 10 points and the resulting values were averaged.

(Evaluations)

For each of the samples, the following evaluations were performed.

A. Adhesive Wear

The adhesive wear was evaluated by performing an insertion/extraction test for each of the plated male terminals according to Examples and Comparative Examples by using a commercially available Sn reflow plating female terminal (090 type Sumitomo TS/Yazaki 090II Series female terminal, non-waterproofing/F090-SMTS).

The measurement apparatus used in the test was the 1311NR manufactured by Aikoh Engineering Co., Ltd., and the evaluation was performed with a sliding distance of a male pin of 5 mm. The number of the samples was set at five, and the adhesive wear was evaluated by using the insertion force. As the insertion force, the averaged value of the maximum values of the respective samples was adopted. As the blank material of the adhesive wear, the sample of Comparative Example 11 was adopted.

The intended target of the adhesive wear is less than 85% of the maximum insertion/extraction force of Comparative Example 11. This is because the insertion/extraction force of Comparative Example 3 was 90% of the maximum insertion force of Comparative Example 11, and a larger reduction of the insertion/extraction force than the reduction of the insertion/extraction force in Comparative Example 3 was adopted as the intended target.

B. Whiskers

Whiskers were evaluated by the load test (ball indenter method) of JEITA RC-5241. Specifically, each of the samples was subjected to the load test, and each of the samples subjected to the load test was observed with a SEM (model JSM-5410, manufactured by JEOL Ltd.) at a magnification of 100× to 10000λ, and thus the occurrence state of the whiskers was observed. The load test conditions are shown below.

Diameter of ball indenter: Φ 1 mm±0.1 mm

Test load: 2 N±0.2 N

Test time: 120 hours

Number of samples: 10

The intended property is such that no whiskers 20 μm or more in length occurs, and the biggest intended target is such that no whiskers of any length occurs.

C. Contact Resistance

The contact resistance was measured with the contact simulator model CRS-113-Au manufactured by Yamasaki-seiki Co., Ltd., under the condition of the contact load of 50 kg, on the basis of the four-terminal method. The number of the samples was set at five, and the range from the minimum value to the maximum value of each of the samples was adopted. The intended target was the contact resistance of 10 mΩ or less.

D. Heat Resistance

The heat resistance was evaluated by measuring the contact resistance of a sample after an atmospheric heating (200° C.×1000 h). The intended property was the contact resistance of 10 mΩ or less, and the biggest target was such that the contact resistance was free from variation (equal) between before and after the heat resistance test.

E. Fine Sliding Wear Resistance

The fine sliding wear resistance was evaluated in terms of the relation between the number of the sliding operations and the contact resistance by using the fine sliding tester model CRS-G2050 manufactured by Yamasaki-seiki Co., Ltd., under the conditions of a sliding distance of 0.5 mm, a sliding speed of 1 mm/s, a contact load of 1 N, and a number of the back and forth sliding operations of 500. The number of the samples was set at five, and the range from the minimum value to the maximum value of each of the samples was adopted. The intended property was such that the contact resistance was 100 mΩ or less at the time of the number of sliding operations of 100.

F. Solder Wettability

The solder wettability was evaluated for the samples after plating. A solder checker (SAT-5000, manufactured by Rhesca Corp.) was used, a commercially available 25% rosin-methanol flux was used as a flux, and the solder wetting time was measured by a meniscograph method. A solder Sn-3Ag-0.5Cu (250° C.) was used. The number of the samples was set at five, and the range from the minimum value to the maximum value of each of the samples was adopted. The intended property was such that the zero cross time was 5 seconds (s) or less.

G. Gas Corrosion Resistance

The gas corrosion resistance was evaluated in the following test environment. The evaluation of the gas corrosion resistance was based on the exterior appearance of each of the samples after the completion of an environmental test. The intended property was such that the exterior appearance is hardly discolored or somewhat discolored to a degree practically causing no problem.

Hydrogen sulfide gas corrosion test

Hydrogen sulfide concentration: 10 ppm

Temperature: 40° C.

Humidity: 80% RH

Exposure time: 96 h

Number of samples: 5

H. Mechanical Durability

The mechanical durability was performed as follows. A push-in type terminal was pushed into a through hole (board thickness: 2 mm, through hole: Φ1 mm) and then extracted from the through hole, the cross section of the push-in type terminal was observed with a SEM (model JSM-5410, manufactured by JEOL Ltd.) at a magnification of 100× to 10000× and the occurrence state of powder was examined. The case where the diameter of the powder was less than 5 μm was marked with “circle”, the case where the diameter of the powder was 5 μm or more and less than 10 μm was marked with “triangle”, and the case where the diameter of the powder was 10 μm or more was marked with “X-mark”.

I. Bending Processability

The bending processability was evaluated by using a W-shaped mold on the basis of the 90° bending under the condition that the ratio between the plate thickness of each of the samples and the bending radius was 1. The evaluation was performed as follows: the surface of the bending-processed portion of each of the samples was observed with an optical microscope, and the case where no cracks were observed and practically no problems were determined to be involved was marked with “circle”, and the case where crack(s) was found was marked with “X-mark”. The case where “circle” and “X-mark” were hardly distinguishable from each other was marked with “triangle”.

J. Vickers Hardness

The Vickers hardness of the lower layer was measured by pressing an indenter from the cross section of the lower layer of each of the samples with a load of 980.7 mN (Hv 0.1) and a load retention time of 15 seconds.

K. Indentation Hardness

The indentation hardness of the upper layer was measured with a nanoindentation hardness tester (ENT-2100, manufactured by Elionix Inc.) by pressing an indenter onto the surface of each of the samples with a load of 10 mN.

The indentation hardness of the lower layer was measured by pressing an indenter from the cross section of the lower layer of each of the samples with a load of 10 mN (Hv 0.1) and a load retention time of 15 seconds.

L. Surface Roughness

The measurement of the surface roughness (the arithmetic mean height (Ra) and the maximum height (Rz)) was performed according to JIS B 0601, by using a noncontact three-dimensional measurement apparatus (model NH-3, manufactured by Mitaka Kohki Co., Ltd.). The cutoff was 0.25 mm, the measurement length was 1.50 mm, and the measurement was repeated five times for one sample.

M. Relation Between Thickness of Upper Layer and Minimum Thickness of Upper Layer

The relation between the thickness of the upper layer and the minimum thickness of the upper layer was evaluated by using a HAADF (high-angle annular dark-field) image based on the STEM (scanning transmission electron microscope) analysis. FIG. 4 shows a schematic diagram of the HAADF (high-angle annular dark-field). The evaluation was performed as follows.

(1) In the evaluation, HAADF (high-angle annular dark-field) images at a magnification of 50 k were used, and the reference length of 3 μm/field of view was adopted.

(2) In the reference length of 3 μm/field of view, the minimum thickness site of the upper layer was identified. When the minimum thickness site was hardly identified, the site concerned was identified with a magnification, if necessary, elevated to a higher level.

(3) In order to precisely determine the minimum thickness of the upper layer, the identified site was observed with a higher magnification. By using HAADF (high-angle annular dark-field) images at a magnification of 100 to 200K, the “minimum thickness of the upper layer” was precisely determined.

(4) The relation between the above-described “thickness (μm) of the upper layer” determined by the line analysis based on the STEM (scanning transmission electron microscope) analysis and the “minimum thickness (μm) of the upper layer” was grasped by measuring five fields of view per one sample.

FIG. 4 schematically depicts the surface roughness of each of the layers as exaggerated than actual observation so as for the above-described (1) to (4) to be easily understood.

N. Relation Between Thickness of Upper Layer and Maximum Value of Elevation Differences Between Adjacent Hills and Valleys in Profile of Interface Between Upper Layer and Intermediate Layer

The relation between the thickness of the upper layer and the maximum value of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer was evaluated by using the HAADF (high-angle annular dark-field) image based on the STEM (scanning transmission electron microscope) analysis. FIG. 4 shows a schematic diagram of the HAADF (high-angle annular dark-field) image. The evaluation was performed as follows.

(1) In the evaluation, HAADF (high-angle annular dark-field) images at a magnification of 50 k were used, and the reference length of 3 μm/field of view was adopted.

(2) In the reference length of 3 μm/field of view, the maximum value site of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer was identified. When the maximum value site of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer was hardly identified, the site concerned was identified with a magnification, if necessary, elevated to a higher level.

(3) In order to precisely determine the maximum value site of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer, the identified site was observed with a higher magnification. By using HAADF (high-angle annular dark-field) images at a magnification of 100 to 200K, the “maximum value of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer” was precisely determined.

(4) The relation between the above-described “thickness (μm) of the upper layer” determined by the line analysis based on the STEM (scanning transmission electron microscope) analysis and the “maximum value of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer” was grasped by measuring five fields of view per one sample.

FIG. 4 schematically depicts the surface roughness of each of the layers as exaggerated than actual observation so as for the above-described (1) to (4) to be easily understood.

The test conditions and the test results are shown in the tables presented below. In the tables presented below, the “composition” represents the ratio between the respective atomic concentrations (at %).

TABLE 1 First plating Second plating Third plating Plating Plating Plating Heat treatment conditions Thickness conditions Thickness conditions Thickness Temperature Time No. [μm] No. [μm] No. [μm] [° C.] [sec] Atmosphere Examples 1 1 1 1 0.22 1 0.14 300 3 The air 2 1 1 1 0.04 1 0.1 300 3 The air 3 1 1 1 0.5 1 0.2 300 10 The air 4 1 1 1 0.22 1 0.09 300 3 The air 5 1 1 1 0.22 1 0.3 300 3 The air 6 1 1 1 0.22 1 0.45 300 3 The air 7 1 0.07 1 0.22 1 0.14 300 3 The air 8 1 0.5 1 0.22 1 0.14 300 3 The air 9 1 3 1 0.22 1 0.14 300 3 The air 10 1 1 1 0.35 1 0.14 300 3 The air 11 1 1 1 0.1 1 0.2 300 3 The air 12 1 1 1 0.2 1 0.17 300 3 The air 13 1 1 1 0.22 1 0.14 260 3 The air 14 1 1 1 0.22 1 0.14 280 3 The air 15 1 1 1 0.07 1 0.2 400 3 The air 16 2 1 1 0.22 1 0.14 300 3 The air 17 4 1 1 0.22 1 0.14 300 3 The air 18 1 1 1 0.22 1 0.14 300 3 The air 19 1 1 1 0.22 1 0.14 300 3 The air 20 3 1 1 0.22 1 0.14 300 3 The air 21 1 1 1 0.04 1 0.185 300 3 The air 22 1 1 1 0.22 1 0.14 255 3 The air 23 1 1 1 0.22 1 0.14 285 3 The air 24 1 1 1 0.25 1 0.11 600 0.5 The air 41 1 1 1 0.23 1 0.11 285 3 The air Reference 1 1 1 1 0.1 1 0.3 280 3 The air Examples 2 1 1 1 0.22 1 0.14 250 3 The air 3 1 1 1 0.7 1 0.2 350 5 The air 4 1 1 1 0.05 1 0.2 280 3 The air 5 5 1 1 0.22 1 0.14 300 3 The air 6 1 1 1 0.04 1 0.185 300 3 The air 7 1 1 1 0.04 1 0.185 300 3 The air 8 1 1 1 0.22 1 0.14 300 3 100% Oxygen 9 1 1 1 0.02 1 0.05 300 3 The air Comparative 1 1 1 1 0.01 1 0.05 300 3 The air Examples 2 1 1 1 1 1 0.3 500 5 The air 3 1 1 2 0.6 300 5 The air 4 1 1 1 0.22 1 0.07 300 3 The air 5 1 1 1 0.22 1 0.6 300 3 The air 6 1 0.03 1 0.22 1 0.14 300 3 The air 7 1 5.5 1 0.22 1 0.14 300 3 The air 8 1 0.5 1 1 1 0.05 600 30 The air 9 1 0.5 1 0.5 1 0.06 500 18 The air 11 4 1 2 1 300 5 The air

TABLE 2 Conditions of treatment with phosphoric acid ester- based solution Cyclic Intensity ratio Phosphoric organic Deposition Deposition I(P2s)/I(N1s) acid ester compound amount of P amount of N between P and N No. species species mol/cm² mol/cm² detected by XPS Examples 25 A1 B1 1 × 10⁻⁹ 8 × 10⁻¹¹ 1.13 26 A1 B1 3 × 10⁻⁹ 9 × 10⁻¹¹ 1.82 27 A2 B1 2 × 10⁻⁹ 8 × 10⁻¹¹ 1.40 28 A1 B2 2 × 10⁻⁹ 9 × 10⁻¹¹ 1.83 29 A1 B3 2 × 10⁻⁹ 8 × 10⁻¹¹ 1.29 30 A1 B3  1 × 10⁻¹² 8 × 10⁻¹¹ 0.06 31 A1 B1  1 × 10⁻¹¹ 8 × 10⁻¹¹ 0.13 32 A1 B1 4 × 10⁻⁸ 8 × 10⁻¹¹ 10.67 33 A1 B1  7 × 10⁻¹⁰ 2 × 10⁻¹² 1.62 34 A1 B1 2 × 10⁻⁹ 8 × 10⁻¹¹ 1.47 35 A1 B1 2 × 10⁻⁹ 8 × 10⁻¹¹ 1.47 36 A1 B1  5 × 10⁻¹² 8 × 10⁻¹³ 1.00 37 A1 B1 8 × 10⁻⁸ 4 × 10⁻⁸  3.49 38 A1 B1 9 × 10⁻⁷ 8 × 10⁻¹¹ 53.40 39 A1 — 2 × 10⁻⁹ — ∞ 40 — B1 — 8 × 10⁻¹¹ 0 *) In relation to “Conditions of treatment with phosphoric acid ester-based solution,” in Example 34, anode electrolysis was performed at 2 V for 5 seconds, and in Examples other than Example 34, immersion treatment was performed. A1: Lauryl acidic phosphoric acid monoester (phosphoric acid monolauryl ester) A2: Lauryl acidic phosphoric acid diester (phosphoric acid dilauryl ester) B1: Benzotriazole B2: Na salt of mercaptobenzothiazole B3: Tolyltriazole

TABLE 3 Composition Thickness and thickness ratio between of layer upper layer between Upper layer Intermediate layer and intermediate Thickness Thickness intermediate layer and lower Composition Structure [μm] Composition Structure [μm] layer layer Examples 1 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 2 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.07 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 5:5 — 3 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.60 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 9:1 — 4 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.04 88:12 — 5 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.20 6:4 — 6 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.35 46:54 — 7 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 8 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 9 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 10 Ag:Sn = 85:15 ζ-Phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 11 Ag:Sn = 4:6 ε-Phase + β-Sn phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 12 Ag:Sn = 3:1 ε-Phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 13 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 4:6 Ni₃Sn₂ 0.07 8:2 — 14 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 5:5 Ni₃Sn₂ + Ni₃Sn₄ 0.07 8:2 — 15 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.10 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.20 1:2 — 16 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 17 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 18 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 19 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 20 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Cu = 7:3 — 0.07 8:2 — 21 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.05 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.25 17:83 — 22 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 37:63 Ni₃Sn + Ni₃Sn₄ 0.07 8:2 — 23 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 55:45 Ni₃Sn₄ 0.07 8:2 — 24 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 Ag:Ni = 1:4, 0.03 μm 41 Ag:Sn = 3:1 ε-Phase 0.30 Sn:Ni = 55:45 Ni₃Sn₄ 0.07 8:2 — Reference 1 Ag:Sn = 3:7 ε-Phase + β-Sn phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — Examples 2 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 3:7 Ni₃Sn + Ni₃Sn₄ 0.07 8:2 — 3 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.90 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 93:7  — 4 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.07 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.20 1:3 — 5 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 6 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.05 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.25 17:83 — 7 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.05 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.25 17:83 — 8 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 9 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.03 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 3:7 — Compar- 1 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.01 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 13:87 — ative 2 Ag:Sn = 8:2 ζ-Phase + ε-phase 1.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07  5:95 — Examples 3 Sn βSn 0.6 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 9:1 — 4 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.90 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.005 99:1  — 5 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.50 38:62 — 6 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 7 Ag:Sn = 8:2 ζ-Phase + ε-phase 0.30 Sn:Ni = 7:3 N₃Sn₄ + β-Sn 0.07 8:2 — 8 Ag—Sn = 97:3 ε-Phase + β-Sn phase 0.9 — — 9 Ag—Sn = 92:8 ε-Phase + β-Sn phase 0.45 — — 11 Sn 0.8 — — — — — Intended 0.02 or 0.01 or target more and more and less than less than 1.00 0.40

TABLE 4 Whiskers Number of Number of Upper layer whiskers whiskers of Lower layer Surface Lower layer less than 20 20 μm or Thick- Nanoindentation roughness Vickers Nanoindentation μm in more in ness hardness Ra Rz hardness hardness length length Composition [μm] [MPa] [μm] [μm] Hv [MPa] [pieces] [pieces] Examples 1 Ni (semi-glossy) 1 4000 0.22  2.35 300 3400 0 0 2 Ni (semi-glossy) 1 — — — — — 0 0 3 Ni (semi-glossy) 1 — — — — — 0 0 4 Ni (semi-glossy) 1 — — — — — 0 0 5 Ni (semi-glossy) 1 — — — — — 0 0 6 Ni (semi-glossy) 1 — — — — — 0 0 7 Ni (semi-glossy) 0.07 — — — — — 0 0 8 Ni (semi-glossy) 0.5 — — — — — 0 0 9 Ni (semi-glossy) 3 — — — — — 0 0 10 Ni (semi-glossy) 1 — — — — — 0 0 11 Ni (semi-glossy) 1 — — — — — 0 0 12 Ni (semi-glossy) 1 — — — — — 0 0 13 Ni (semi-glossy) 1 — — — — — 0 0 14 Ni (semi-glossy) 1 — — — — — 0 0 15 Ni (semi-glossy) 1 — — — — — 0 0 16 Ni (glossy) 1 7000 — — 600 6700 0 0 17 Ni (matte) 1 1200 — — 130 1300 0 0 18 Ni (semi-glossy) 1 — 0.18 1.8 — — 0 0 19 Ni (semi-glossy) 1 — 0.13 1.2 — — 0 0 20 Cu 1 — — — — — 0 0 21 Ni (semi-glossy) 1 — — — — — 0 0 22 Ni (semi-glossy) 1 — — — — — 0 0 23 Ni (semi-glossy) 1 — — — — — 0 0 24 Ni (semi-glossy) 1 — — — — — 0 0 41 Ni (semi-glossy) 1 — — — — — 0 0 Reference 1 Ni (semi-glossy) 1 — — — — — ≦1   0 Examples 2 Ni (semi-glossy) 1 — — — — — 0 0 3 Ni (semi-glossy) 1 — — — — — 0 0 4 Ni (semi-glossy) 1 — — — — — 0 0 5 Ni:P = 98:2 1 11000  — — 1200  12000  0 0 6 Ni (semi-glossy) 1 — — — — — 0 0 7 Ni (semi-glossy) 1 — — — — — 0 0 8 Ni (semi-glossy) 1 — — — — — 0 0 9 Ni (semi-glossy) 1 — — — — — 0 0 Comparative 1 Ni (semi-glossy) 1 — — — — — — — Examples 2 Ni (semi-glossy) 1 — — — — — — — 3 Ni (semi-glossy) 1 — — — — — — ≦2   4 Ni (semi-glossy) 1 — — — — — — — 5 Ni (semi-glossy) 1 — — — — — — — 6 Ni (semi-glossy) 0.03 — — — — — — — 7 Ni (semi-glossy) 5.5 — — — — — — — 8 Ni (matte) 0.5 — — — — — — — 9 Ni (matte) 0.5 — — — — — — — 11 Ni (matte) 1 — — — — — — ≦3   Intended 0.05 or 0 target more and less than 5.00

TABLE 5 Adhesive wear Insertion force Maximum insertion Fine sliding Gas corrosion force/maximum Heat wear Solder resistance insertion force resistance resistance wettability Hydrogen sulfide of Comparative Contact Contact Contact Zero cross Exterior Example 10 resistance resistance resistance time appearance after Mechanical Bending [%] [mΩ] [mΩ] [mΩ] [sec] test durability processability Examples 1 70 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 2 66 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 3 77 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 4 74 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 5 66 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 6 63 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 7 83 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 8 77 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 9 65 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 10 72 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 11 65 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 12 67 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 13 77 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 14 73 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 15 70 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 16 65 1 to 3 1 to 3 10 to 50 1 to 3 Not discolored ◯ ◯ 17 76 1 to 3 2 to 4 10 to 50 2 to 4 Not discolored ◯ ◯ 18 71 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 19 69 1 to 3 1 to 3 10 to 50 1 to 3 Not discolored ◯ ◯ 20 72 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 21 69 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 22 75 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 23 73 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ 24 70 1 to 3 1 to 3 10 to 50 1 to 4 Not discolored ◯ ◯ 41 65 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ ◯ Reference 1 65 1 to 3 1 to 3  30 to 100 2 to 4 Not discolored ◯ ◯ Examples 2 80 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ Δ 3 83 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored Δ ◯ 4 71 1 to 3 3 to 5  30 to 100 3 to 5 Somewhat ◯ ◯ discolored 5 63 1 to 3 1 to 3 10 to 50 2 to 4 Not discolored ◯ X 6 71 1 to 3 3 to 5 10 to 50 3 to 5 Not discolored ◯ ◯ 7 72 1 to 3 3 to 5 10 to 50 3 to 5 Not discolored ◯ ◯ 8 72 2 to 4 3 to 7 10 to 50 3 to 5 Not discolored ◯ ◯ 9 70 1 to 3 3 to 5  30 to 100 3 to 5 Somewhat ◯ ◯ discolored Comparative 1 — 1 to 3 10< 100< 5< Discolored — — Examples 2 88 1 to 3 — — — — X — 3 90 1 to 3 10< 100< — — — — 4 87 1 to 3 — — — — — — 5 — 1 to 3 — — — — X X 6 86 1 to 3 10< — 5< — — — 7 — 1 to 3 — — — — X 8 — 1 to 3 — — — Discolored — — 9 — 1 to 3 — — — Discolored — — 11 100 1 to 3 10< 100< — — — — Intended Less than 85 10 or less 10 or less 100 or less 5 or less Not discolored ◯ target

TABLE 6 Minimum Thickness ratio thick- Upper layer Intermediate layer between upper Lower layer ness of Thick- Thick- and Thick- upper Compo- ness Compo- ness intermediate Compo- ness layer sition Structure [μm] sition Structure [μm] layers sition [μm] [Mm] Examples 21 Ag:Sn = 8.2 ζ-Phase + 0.05 Sn:Ni = 7:3 N₃Sn₄ + β- 0.25 17:83 Ni 1 0.04 ε-phase Sn (Semi- Plating of Ag at 1 A/dm² followed by plating of Sn at 1 A/dm² glossy) Reference 6 Ag:Sn = 8:2 ζ-Phase + 0.05 Sn:Ni = 7:3 N₃Sn₄ + β- 0.25 17:83 Ni 1 0.02 Examples ε-phase Sn (semi- Plating of Ag at 1 A/dm² followed by plating of Sn at 4 A/dm² glossy) 7 Ag:Sn = 8:2 ζ-Phase + 0.05 Sn:Ni = 7:3 N₃Sn₄ + β- 0.25 17:83 Ni 1 0.03 ε-phase Sn (semi- Plating of Ag at 4 A/dm² followed by plating of Sn at 1 A/dm² glossy) Relation between thickness of upper Maximum value of layer and maximum elevation differences value of elevation Exterior Relation between between adjacent hills and differences between appearance thickness of upper valleys in profle of adjacent hills and after gas Heat Solder layer and interface between upper valleys in profile of corrosion resistance wettability minimum layer and intermediate interface between resistance test Contact Contact Zero cross thickness of upper layer upper layer and with hydrogen resistance resistance time layer [μm] intermediate layer sulfide [mΩ] [mΩ] [sec] Examples 21 Minimum 0.018 Maximum value of Not discolored 1 to 3 1 to 3 2 to 4 thickness of upper elevation differences layer ≧ thickness of between adjacent upper layer × 0.5 hills and valleys in profile of interface between upper layer and intermediate layer ≦ thickness of upper layer × 0.5 Reference 6 Minimum 0.021 Maximum value of Somewhat 1 to 3 3 to 5 3 to 5 Examples thickness of upper elevation differences discolored layer < thickness between adjacent of upper layer × hills and valleys in 0.5 profile of interface between upper layer and intermediate layer ≦ thickness of upper layer × 0.5 7 Minimum 0.039 Maximum value of Somewhat 1 to 3 3 to 5 3 to 5 thickness of upper elevation differences discolored layer ≧ thickness of between adjacent upper layer × 0.5 hills and valleys in profile of interface between upper layer and intermediate layer > thickness of upper layer × 0.5

TABLE 7 Surface of upper layer Region where atomic concentration (at %) Heat Solder Thickness of Sn ≧ atomic con- resis- wetta- ratio centration (at %) of tance bility Upper layer Intermediate layer between Ag and atomic concen- Contact Contact Zero Thick- Thick- upper and tration (at %) of resis- resis- cross Compo- ness Compo- ness intermediate O ≧ 10 at % tance tance time sition Structure [μm] sition Structure [μm] layers [μm] [mΩ] [mΩ] [sec] Examples 1 Ag:Sn = ζ-Phase + 0.30 Sn:Ni = N₃Sn₄ + 0.07 8:2 0.0005 to 0.005 1 to 3 1 to 3 2 to 4 8:2 ε-phase 7:3 β-Sn 2 Ag:Sn = ζ-Phase + 0.07 Sn:Ni = N₃Sn₄ + 0.07 5:5 0.0005 to 0.005 1 to 3 1 to 3 2 to 4 8:2 ε-phase 7:3 β-Sn 3 Ag:Sn = ζ-Phase + 0.60 Sn:Ni = N₃Sn₄ + 0.07 9:1 0.0005 to 0.005 1 to 3 1 to 3 2 to 4 8:2 ε-phase 7:3 β-Sn Reference 8 Ag:Sn = ζ-Phase + 0.30 Sn:Ni = N₃Sn₄ + 0.07 8:2 0.030 2 to 4 3 to 7 3 to 5 Examples 8:2 ε-phase 7:3 β-Sn

TABLE 8 Adhesive wear Insertion force Maximum Whiskers insertion Number of Number of force/maximum whiskers less whiskers of 20 insertion force of Heat resistance than 20 μm in μm or more in Comparative Contact Contact length length Example 10 resistance resistance [pieces] [pieces] [%] [mΩ] [mΩ] Examples 25 0 0 63 1 to 2 1 to 2 26 0 0 67 1 to 2 1 to 2 27 0 0 66 1 to 2 1 to 2 28 0 0 65 1 to 2 1 to 2 29 0 0 67 1 to 2 1 to 2 30 0 0 64 1 to 2 1 to 2 31 0 0 63 1 to 2 1 to 2 32 0 0 65 1 to 2 1 to 2 33 0 0 67 1 to 2 1 to 2 34 0 0 65 1 to 2 1 to 2 35 0 0 65 1 to 2 1 to 2 36 0 0 67 1 to 2 1 to 2 37 0 0 65 1 to 2 1 to 2 38 0 0 64 1 to 2 1 to 2 39 0 0 68 1 to 2 1 to 3 40 0 0 70 1 to 3 1 to 3 Intended 0 Less than 85 10 or less 10 or less target Gas corrosion Fine sliding resistance wear Hydrogen resistance Solder sulfide Contact wettability Exterior Mechan- resistance Zero cross time appearance ical dura- Bending [mΩ] [sec] after test bility processability Examples 25 10 to 30 0.5 to 2 Not discolored ◯ ◯ 26 10 to 30 0.5 to 2 Not discolored ◯ ◯ 27 10 to 30 0.5 to 2 Not discolored ◯ ◯ 28 10 to 30 0.5 to 2 Not discolored ◯ ◯ 29 10 to 30 0.5 to 2 Not discolored ◯ ◯ 30 10 to 30 0.5 to 2 Not discolored ◯ ◯ 31 10 to 30 0.5 to 2 Not discolored ◯ ◯ 32 10 to 30 0.5 to 2 Not discolored ◯ ◯ 33 10 to 30 0.5 to 2 Not discolored ◯ ◯ 34 10 to 30 0.5 to 2 Not discolored ◯ ◯ 35 10 to 30 0.5 to 2 Not discolored ◯ ◯ 36 10 to 30 0.5 to 2 Not discolored ◯ ◯ 37 10 to 30 0.5 to 2 Not discolored ◯ ◯ 38 10 to 30 0.5 to 2 Not discolored ◯ ◯ 39 10 to 40   1 to 3 Not discolored ◯ ◯ 40 10 to 50   2 to 4 Not discolored ◯ ◯ Intended 100 or less 5 or less Not discolored ◯ ◯ target

Examples 1 to 41 were each a metallic material for electronic components excellent in any of the low degree of whisker formation, the low adhesive wear property and the high durability.

In Reference Example 1, the ratio of Ag:Sn in the upper layer was 3:7 for the proportion of Sn in the upper layer to be larger as compared with Example 1, and hence the whiskers less than 20 μm in length sometimes occurred, although the intended properties were obtained and the whiskers of 20 μm or more in length did not occur.

In Reference Example 2, the ratio of Sn:Ni in the intermediate layer was 3:7, the proportion of Ni in the intermediate layer was larger as compared with Example 1, and hence the bending processability was somewhat poorer as compared with Example 1 although the intended properties were obtained.

In Reference Example 3, the thickness of the upper layer was 0.90 μm, the thickness of the upper layer was larger as compared with Example 1, and the mechanical durability was somewhat poorer as compared with Example 1 although the intended properties were obtained.

In Reference Example 4, the thickness ratio between the upper layer and the lower layer was such that upper layer:lower layer=1:3, thus the proportion of the lower layer was larger, and hence the heat resistance, the fine sliding wear resistance, the solder wettability and the gas corrosion resistance were somewhat poorer as compared with Examples although the intended properties were obtained.

In Reference Example 5, the nanoindentation hardness of the upper layer, and the nanoindentation hardness and the Vickers hardness of the lower layer were larger as compared with Example 1, and hence the bending processability was poor although the intended properties were obtained.

In Reference Example 6, the minimum thickness of the outermost layer was less than 50% of the thickness of the outermost layer, the heat resistance, the solder wettability and the gas corrosion resistance were poorer than those of Examples although the intended properties were obtained.

In Reference Example 7, the maximum value of the elevation differences between the adjacent hills and valleys in the profile of the interface between the outermost layer and the upper layer exceeds 50% of the thickness of the outermost layer, and hence the heat resistance, the solder wettability and the gas corrosion resistance were poorer than those of Examples although the intended properties were obtained.

In Reference Example 8, on the surface of the upper layer, a region where the total atomic concentration (at %) of the constituent elements B≧the total atomic concentration (at %) of the constituent elements C and the atomic concentration (at %) of O≧10 at % was present in the range exceeding 0.02 μm, and hence the heat resistance and the solder wettability were poorer than those of Examples although the intended properties were obtained.

In Reference Example 9, the thickness of the upper layer was as thinner as 0.03 μm than those of Examples, the heat resistance, the solder wettability and the gas corrosion resistance were poorer than those of Examples although the intended properties were obtained.

In Comparative Example 1, the thickness of the upper layer was thinner than the intended target, and hence the heat resistance, the fine sliding wear resistance, the solder wettability and the gas corrosion resistance were poor.

In Comparative Example 2, the thickness of the upper layer was thicker than the intended target, and hence the adhesive wear was large and accordingly the insertion force was high, and the mechanical wear was poor.

In Comparative Example 3, β-Sn was alone present in the upper layer, and hence whiskers of 20 μm or more in length occurred, the adhesive wear was large, accordingly the insertion force was high, and the heat resistance and the fine sliding wear resistance were poor.

In Comparative Example 4, the thickness of the intermediate layer was thinner than the intended target, and hence the adhesive wear was large and accordingly the insertion force was high.

In Comparative Example 5, the thickness of the intermediate layer was thicker than the intended target, and hence the mechanical wear and the bending processability were poor.

In Comparative Example 6, the thickness of the lower layer was thinner than the intended target, and hence the adhesive wear was large and accordingly the insertion force was high, and the heat resistance and the solder wettability were poor.

In Comparative Example 7, the thickness of the lower layer was thicker than the intended target, and hence the bending processability was poor.

In each of Comparative Examples 8 to 9, the proportion of Ag in the upper layer was high, and hence the gas corrosion resistance was poor.

Comparative Example 11 is the blank material of the present invention. In Comparative Example 11, the whiskers of 20 μm or more occurred, and the heat resistance and the fine sliding wear resistance were poor.

FIG. 5 shows the results of the line analysis with a STEM (scanning transmission electron microscope) according to an embodiment of the present invention. As can be seen from FIG. 5, sequentially from the outermost surface, an Ag—Sn alloy was present in a thickness of 0.3 μm, and an Sn—Ni alloy was present in a thickness of 0.07 μm. Moreover, the composition (at %) of the Ag—Sn alloy is such that Ag:Sn=8:2, and as can be seen from the Ag—Sn phase diagram of FIG. 6, β-Sn is not present in the Ag—Sn alloy, and the ζ-phase (Sn: 11.8 to 22.9%) and the ε-phase (Ag₃Sn) of the Sn—Ag alloy are present. The composition (at %) of the Sn—Ni alloy is such that Sn:Ni=7:3, and as can be seen from the Sn—Ni phase diagram of FIG. 7, Ni₃Sn₄ of the Sn—Ni alloy and β-Sn are present.

REFERENCE SIGNS LIST

-   10 Metallic material for electronic components -   11 Base material -   12 Lower layer -   13 Intermediate layer -   14 Upper layer 

1. A metallic material for electronic components, comprising: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μM or more and less than 0.40 μm; and the thickness of the upper layer is 0.02 μM or more and less than 1.00 μm.
 2. The metallic material for electronic components according to claim 1, wherein the minimum thickness (μm) of the upper layer is 50% or more of the thickness (μm) of the upper layer.
 3. The metallic material for electronic components according to claim 1, wherein the maximum value (μm) of the elevation differences between the adjacent hills and valleys in the profile of the interface between the upper layer and the intermediate layer is 50% or less of the thickness (μm) of the upper layer.
 4. The metallic material for electronic components according to claim 1, wherein on the surface of the upper layer, a region where the total atomic concentration (at %) of the constituent elements B the total atomic concentration (at %) of the constituent elements C and the atomic concentration (at %) of O≧10 at % of O is present in the range of 0.02 μm or less.
 5. The metallic material for electronic components according to claim 1, wherein the upper layer comprises the metal(s) of the constituent element group B in a content of 10 to 50 at %.
 6. The metallic material for electronic components according to claim 1, wherein a ζ(zeta)-phase being a Sn—Ag alloy and/or an ε(epsilon)-phase being a Sn—Ag alloy is present.
 7. (canceled)
 8. (canceled)
 9. (canceled)
 10. The metallic material for electronic components according to claim 6, wherein β-Sn being a Sn single phase is further present.
 11. (canceled)
 12. The metallic material for electronic components according to claim 1, wherein the intermediate layer includes a metal(s) of the constituent element group B in a content of 35 at % or more.
 13. The metallic material for electronic components according to claim 1, wherein in the intermediate layer, Ni₃Sn₄ and Ni₃Sn₂ are present.
 14. The metallic material for electronic components according to claim 1, wherein in the intermediate layer, Ni₃Sn₄ and β Sn being a Sn single phase are present.
 15. The metallic material for electronic components according to claim 1, wherein the thickness ratio between the upper layer and the intermediate layer is such that upper layer:intermediate layer=9:1 to 3:7.
 16. The metallic material for electronic components according to claim 1, wherein in the range from the upper layer to the intermediate layer, exclusive of the range of 0.03 μm from the outermost surface of the upper layer, C, S and O are each included in a content of 2 at % or less.
 17. The metallic material for electronic components according to claim 1, wherein the indentation hardness of the surface of the upper layer, namely, the hardness obtained by hitting a dent on the surface of the upper layer with a load of 10 mN on the basis of a nanoindentation hardness test, is 1000 MPa or more.
 18. The metallic material for electronic components according to claim 1, wherein the indentation hardness measured from the surface of the upper layer, namely, the hardness obtained by hitting a dent on the surface of the upper layer with a load of 10 mN on the basis of a nanoindentation hardness test, is 10000 MPa or less.
 19. (canceled)
 20. (canceled)
 21. (canceled)
 22. (canceled)
 23. (canceled)
 24. The metallic material for electronic components according to claim 1, wherein the content of the metal(s) of the constituent element group A is 50% by mass or more in terms of the total content of Ni, Cr, Mn, Fe, Co and Cu, and one or two or more selected from the group consisting of B, P, Sn and Zn are further included.
 25. The metallic material for electronic components according to claim 1, wherein the content of the metal(s) of the constituent element group B is 50% by mass or more in terms of the total content of Sn and In, and the rest alloy component is composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn.
 26. (canceled)
 27. (canceled)
 28. (canceled)
 29. (canceled)
 30. The metallic material for electronic components according to claim 1, wherein the indentation hardness of the cross section of the lower layer, namely, the hardness obtained by hitting a dent on the cross section of the lower layer with a load of 10 mN on the basis of a nanoindentation hardness test is 10000 MPa or less.
 31. The metallic material for electronic components according to claim 1, wherein the intermediate layer is constituted with Ni₃Sn and Ni₃Sn₂.
 32. The metallic material for electronic components according to claim 1, wherein the intermediate layer is constituted with Ni₃Sn₂.
 33. The metallic material for electronic components according to claim 1, wherein the intermediate layer is constituted with Ni₃Sn₄.
 34. The metallic material for electronic components according to claim 1, further comprising, between the lower layer and the intermediate layer, a layer constituted with the alloy of the metal(s) of the constituent element group A and the metal(s) of the constituent element group C.
 35. The metallic material for electronic components according to claim 1, wherein P is deposited on the surface of the upper layer, and the deposition amount of P is 1×10⁻¹¹ to 4×10⁻⁸ mol/cm².
 36. (canceled)
 37. The metallic material for electronic components according to claim 35, wherein in an XPS analysis performed for the upper layer, with I(P2s) denoting the photoelectron detection intensity due to the 2S orbital electron of P to be detected and I(N1s) denoting the photoelectron detection intensity due to the 15 orbital electron of N to be detected, the relation 0.1≦I(P2s)/I(N1s)≦1 is satisfied.
 38. The metallic material for electronic components according to claim 35, wherein in an XPS analysis performed for the upper layer, with I(P2s) denoting the photoelectron detection intensity due to the 2S orbital electron of P to be detected and I(N1s) denoting the photoelectron detection intensity due to the 1S orbital electron of N to be detected, the relation 1≦I(P2s)/I(N1s)≦50 is satisfied.
 39. A method for producing the metallic material for electronic components according to claim 35, the metallic material comprising: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, wherein the surface of the metallic material is surface-treated with a phosphoric acid ester-based solution including at least one of the phosphoric acid esters represented by the following formulas 1 and 2, and at least one selected from the group of the cyclic organic compounds represented by the following general formulas 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h, 3i, and 3j, and the formulas 4a, 4b, and 4c:

wherein, in formulas 1 and 2, R₁ and R₂ each represent a substituted alkyl group and M represents a hydrogen atom or an alkali metal atom;

wherein, in formula 4a, R₁ represents a hydrogen atom, an alkyl group or a substituted alkyl group; R₂ represents an alkali metal atom, a hydrogen atom, an alkyl group or a substituted alkyl group; in formula 4c, R₃ represents an alkali metal atom or a hydrogen atom; in formula 4b R₄ represents —SH, an alkyl group-substituted or aryl group-substituted amino group, or represents an alkyl-substituted imidazolylalkyl group; and R₅ and R₆ each represent —NH₂, —SH or —SM, wherein M represents an alkali metal atom.
 40. The method for producing a metallic material for electronic components according to claim 39, wherein the surface treatment with the phosphoric acid ester-based solution is performed by applying the phosphoric acid ester-based solution to the upper layer.
 41. The method for producing a metallic material for electronic components according to claim 39, wherein the surface treatment with the phosphoric acid ester-based solution is performed by conducting an electrolysis by immersing the metallic material after the formation of the upper layer in the phosphoric acid ester-based solution and using as the anode the metallic material after the formation of the upper layer.
 42. (canceled)
 43. A connector using in the contact portion thereof, the metallic material for electronic components according to claim
 1. 44. An FFC terminal using, in the contact portion thereof, the metallic material for electronic components according to claim
 1. 45. An FPC terminal using, in the contact portion thereof, the metallic material for electronic components according to claim
 1. 46. (canceled)
 47. (canceled)
 48. An electronic component using, in the electrode thereof for external connection, the metallic material for electronic components according to claim
 1. 49. An electronic component using the metallic material for electronic components according to claim 1, in a push-in type terminal thereof for fixing a board connection portion to a board by pushing the board connection portion into the through hole formed in the board, wherein a female terminal connection portion and the board connection portion are provided respectively on one side and the other side of a mounting portion to be attached to a housing. 